Likewise, the heat dissipation area measures 39606mm2. The VC heatsink is made up of steel and copper and has a surface area of 4129mm2. It consists of a VC heatsink, 3D graphite layer, and diamond thermal gel. Realme GT Neo 3 has an upgraded nine-layer heat dissipation structure to keep the core temperature in check. ![]() Over on the memory front, there is support for LPDDR5 RAM and UFS 3.1 storage. Realme GT Neo 3 is powered by the newly announced Dimensity 8100, which the company has placed as a “power-efficient” version of the Dimensity 9000.īased on a 5nm process, the new chip brings four Cortex-A78 cores and four Cortex A55 efficiency cores 2.0GHz). While the Neo 2 employed a competent Snapdragon 870 chip, Realme has turned to MediaTek for its successor. It takes the phone from 0 to 100% in just 32 minutes. For those that don’t need that charging speed, Realme is also offering the GT Neo 3 with comparatively slower 80W Super VOOC charging and a larger 5,000mAh battery.
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